Hot Semiconductor Stocks To Invest In 2014

The Santa Clara-based semiconductor machinery manufacturer, Applied Materials (AMAT), announced quarterly operating results after the closing bell on Thursday, which barely topped analyst estimates.�

AMAT Earnings in Brief

-AMAT announced Q4 EPS of $0.19, managing to beat the projected figure of $0.18 per share by a penny.
-The company raked in revenues of $2.09 billion, coming in above the expected figure of $1.99 billion; this figure was 5% higher than the previous quarter and was largely bolstered by growth in silicon systems orders.
-Net sales in Q4 came in at $1.99 billion, up 1% sequentially.

Top 10 Insurance Companies To Invest In 2015: Sunedison Inc (SUNE)

SunEdison Inc, formerly MEMC Electronic Materials, Inc., incorporated on October 1, 1984, is engaged in the development, manufacture and sale of silicon wafers. The Company is a developer and seller of photovoltaic energy solutions. Through Solar Materials and Solar Energy (SunEdison), it is a developer of solar energy projects. The Company operates in two segments: semiconductor materials and solar energy. The Company�� Solar Energy segment includes the operations of its old Solar Materials segment, as well as its SunEdison business. In the Semiconductor Materials, the Company offers wafers with a variety of features. The Company�� wafers vary in size, surface features, composition, purity levels, crystal properties and electrical properties.

Semiconductor Materials

The Company�� monocrystalline wafers for use in semiconductor applications range in size from 100 millimeter to 300 millimeter and are round in shape for semiconductor customers because of the nature of their processing equipment. Its wafers are used as the starting material for the manufacture of various types of semiconductor devices, including microprocessor, memory, logic and power devices. In turn, these semiconductor devices are used in computers, cellular phones and other mobile electronic devices, automobiles and other consumer and industrial products. Its monocrystalline wafers for semiconductor applications include four general categories of wafers: prime, epitaxial, test/monitor and silicon-on-insulator (SOI) wafers.

The Company�� prime wafer is a polished, pure wafer with an ultraflat and ultraclean surface. The Company�� epitaxial (epi), wafers consist of a thin silicon layer grown on the polished surface of the wafer. Typically, the epitaxial layer has different electrical properties from the underlying wafer. This provides customers with isolation between circuit elements than a polished wafer. Its AEGIS product is designed for certain specialized applications requiring high resis! tivity epitaxial wafers and its MDZ product feature. The AEGIS wafer includes a thin epitaxial layer grown on a standard starting wafer. The AEGIS wafer�� thin epitaxial layer eliminates harmful defects on the surface of the wafer, thereby allowing device manufacturers to increase yields. The Company supplies test/monitor wafers to its customers for use in testing semiconductor fabrication lines and processes. An SOI wafer is a different starting material for the chip making process.

Solar Energy

The Company�� Solar Energy segment provides solar energy services that integrate the design, installation, financing, monitoring, operations and maintenance portions of the downstream solar market to provide a solar energy service to its customers. As of December 31, 2012, SunEdison interconnected over 675 solar power systems representing 989 megawatt of solar energy generating capacity. As of December 31, 2012, SunEdison had 73 megawatt of projects under construction and 2.6 gigawatts in pipeline. In support of its downstream solar business, its Solar Energy segment manufactures polysilicon, silicon wafers and solar modules. Additionally, its Solar Energy segment will sell solar modules to third parties in the event the opportunity aligns with itsinternal needs. It provides its downstream customers with a way to purchase renewable energy by delivering solar power under long-term power purchase arrangements with customers or feed-in tariff arrangements with government entities and utilities. Its SunEdison business is dependent upon government subsidies, including United States federal incentive tax credits, state-sponsored energy credits and foreign feed-in tariffs. The Company�� solar wafers are used as the starting material for crystalline solar cells.

The Company competes with Shin-Etsu Handotai, SUMCO, Siltronic and LG Siltron, SunPower Corporation, First Solar, Inc., Enerparc, Sharp Corporation (Recurrent Energy), Phoenix Solar, BELECTRIC, JUWI Solar Gmbh, and S! olar City! .

Advisors' Opinion:

• [By Aaron Levitt]

  Utility NextEra Energy (NEE) is the nation�� largest solar and wind operator and just the latest firm to announce its intention to create a YieldCo. Moody�� estimates that about 30 utilities across the globe have the ability to create a YieldCo today based on current power plant holdings. Aside from the utility space, the various solar panel producers that also own/build grid-scale operations have also expressed their intentions about starting YieldCos. These include SunPower (SPWR) and SunEdison (SUNE).

• [By Jayson Derrick]

  SunEdison (NYSE: SUNE) is in talks to invest $2 billion to build a low-cost polysilicon factory in China. The facility will have a capacity of 20,000 to 30,000 metric tons a year that can produce polysilicon for $2 per kilogram less than its rivals. Shares gained 6.81 percent, closing at $16.63.

Hot Semiconductor Stocks To Invest In 2014: Rood Testhouse International NV (ROO)

Rood Testhouse International NV (RoodMicrotec) is a Netherlands-based company, operating an independent and certified test house and analysis lab for opto- and microelectronics. It is a supply chain management organization engaged in partial processes essential to reliable end-products. Its core services are managing the entire process from design idea all the way to supply to the end-user, including purchasing, logistics, warehousing/logistics; securing testability and manufacturability at an early stage in the chip design process. Its activities include supply chain amangement, test and end-of-line services, failure and technology analysis, test engineering, qualifications and reliability, as well as engineering/consulting/key account project management. It has six wholly owned subsidiaries: RoodMicrotec International B.V., RoodMicrotec Holding GmbH, RoodMicrotec Beteiligungs GmbH, RoodMicrotec Nordlingen GmbH + Co. KG, RoodMicrotec Dresden GmbH and RoodMicrotec Stuttgart GmbH. Advisors' Opinion:

• [By Alan Ellman]

  The day is Friday July 12, and the stock is LEAP Wireless International Inc. (LEAP), which is a takeover candidate by AT&T. In the late afternoon, the share price was near $8 per share, the July $9 call option was priced @ $0.10, and the August $9 call @ $0.40. Covered call writers could generate an initial profit (ROO) of 1% and 5%, respectively. The average daily option trading volume for this company is 1320 contracts over the last three months. It appeared to be a normal trading day until the last hour of trading when option volume went through the roof. By day’s end, 7139 contracts were traded, all but 350 were calls as traders were taking a bullish stance on this stock. I think you know what’s coming!

Hot Semiconductor Stocks To Invest In 2014: Advanced Semiconductor Engineering Inc (ASX)

Advanced Semiconductor Engineering, Inc. is principally engaged in the manufacture, assembly, processing, testing and distribution of integrated circuits (ICs). The Company provides semiconductor packaging and testing services, including plastic leaded chip carriers (PLCCs), quad flat packages (QFPs) and flip chip packaging technology, among others, which are applied in the manufacture of household electrical appliances, communication devices, automobile components, personal computers, set top boxes, servers, memory integrated circuits (ICs), mobile phones, digital cameras, game consoles, projectors, high definition (HD) televisions, wireless communication network products and power management ICs, among others. The Company operates its businesses primarily in Taiwan, Europe and the Americas. In August 2010, the Company acquired a 100% interest in EEMS Test Singapore.

The Company is focused on packaging and testing logic semiconductors. The Company offers its customers turnkey services, which consist of packaging, testing and direct shipment of semiconductors to end users designated by its customers. The Company�� global base of over 200 customers includes semiconductor companies across a range of end use applications, including Altera Corporation, ATI Technologies, Inc., Broadcom Corporation, Cambridge Silicon Radio Limited and Microsoft Corporation. During the year ended December 31, 2008, the Company�� packaging revenues accounted for 77.7% of its net revenues and its testing revenues accounted for 20.1% of its net revenues.

Packaging Services

The Company offers a range of package types to meet the requirements of its customers, with a focus on packaging solutions. Within its portfolio of package types, the Company focuses on the packaging of semiconductors. These include advanced leadframe-based package types, such as quad flat package, thin quad flat package, bump chip carrier and quad flat no-lead package, and package types based on substrates, such a! s flip-chip ball grid array (BGA) and other BGA types, as well as other packages, such as wafer-bumping products. Leadframe-based packages are packaged by connecting the die, using wire bonders, to the leadframe with gold wire. The Company�� leadframe-based packages include quad flat package (QFP)/ thin quad flat package (TQFP), quad flat no-lead package (QFN)/microchip carrier (MCC), advanced quad flat no-lead package (AQFN), bump chip carrier (BCC), small outline plastic package (SOP)/thin small outline plastic package (TSOP), small outline plastic j-bend package (SOJ), plastic leaded chip carrier (PLCC) and plastic dual in-line package (PDIP). Substrate-based packages employ the BGA design, which utilizes a substrate rather than a leadframe. It also assembles system-in-a-package products, which involve the integration of more than one chip into the same package. The Company�� substrate-based packages include Plastic BGA, Cavity Down BGA, Stacked-Die BGA, Flip-Chip BGA and land grid array (LGA).

The Company�� wafer-level packaging products include wafer level chip scale package (aCSP) and advanced wafer level package (aWLP). The Company offers module assembly services, which combine one or more packaged semiconductors with other components in an integrated module to enable functionality, typically using surface mount technology (SMT) machines and other machinery and equipment for system-level assembly. End use applications for modules include cellular phones, personal digital assistant (PDAs), wireless local area network (LAN) applications, bluetooth applications, camera modules, automotive applications and toys.

The Company provides module assembly services primarily at its facilities in Korea for radio frequency and power amplifier modules used in wireless communications and automotive applications. Interconnect materials connect the input/output on the semiconductor dies to the printed circuit board. Interconnect materials include substrate, which is a multi-layer m! iniature ! printed circuit board. The Company produces substrates for use in its packaging operations.

Testing Services

The Company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, final testing of logic/mixed-signal/radio frequency (RF) and memory semiconductors and other test-related services. The Company provides front-end engineering testing services, including customized software development, electrical design validation, and reliability and failure analysis. The Company provides final testing services for a variety of memory products, such as static random access memory (SRAM), dynamic random access memory (DRAM), single-bit erasable programmable read-only memory semiconductors and flash memory semiconductors.

The Company provides a range of additional test-related services, including burn-in testing, module sip testing, dry pack, tape and reel, and electric interface board and mechanical test tool design. The Company offers drop shipment services for shipment of semiconductors directly to end users designated by its customers.

Advisors' Opinion:

• [By Seth Jayson]

  Advanced Semiconductor Engineering (NYSE: ASX  ) is expected to report Q2 earnings around July 7. Here's what Wall Street wants to see:

• [By Alexis Xydias]

  The FTSE 100 Index (UKX) gained 53.93 points, or 0.8 percent, to 6,683.93 at 8:58 a.m. in London, rebounding from a 1.4 percent loss yesterday. The benchmark has rallied 13 percent this year as central banks around the world commit to maintain monetary stimulus to nurture economic growth. The broader FTSE All-Share Index (ASX) increased 0.8 percent today, while Ireland�� ISEQ Index advanced 0.5 percent.

Hot Semiconductor Stocks To Invest In 2014: Texas Instruments Incorporated(TXN)

Texas Instruments Incorporated engages in the design and sale of semiconductors to electronics designers and manufacturers worldwide. The company?s Analog segment offers high-performance analog products comprising standard analog semiconductors, such as amplifiers, data converters, and interface semiconductors; high-volume analog and logic products; and power management semiconductors and line-powered systems. Its Embedded Processing segment includes DSPs that perform mathematical computations to process and enhance digital data; and microcontrollers, which are designed to control a set of specific tasks for electronic equipment. The company?s Wireless segment designs, manufactures, and sells application processors and connectivity products. Its Other segment offers smaller semiconductor products, which include DLP products that are primarily used in projectors to create high-definition images; and application-specific integrated circuits. This segment also provides handhe ld graphing and scientific calculators, as well as licenses technologies to other electronic companies. The company serves the communications, computing, industrial, consumer electronics, automotive, and education sectors. Texas Instruments Incorporated sells its products through a direct sales force, distributors, and third-party sales representatives. It has collaboration agreements with PLX Technology Inc.; Neonode, Inc.; and Ubiquisys Ltd. The company was founded in 1938 and is headquartered in Dallas, Texas.

Advisors' Opinion:

• [By Monica Gerson]

  Texas Instruments (NASDAQ: TXN) is projected to post its Q4 earnings at $0.46 per share on revenue of $2.99 billion.

  Halliburton Company (NYSE: HAL) is expected to report its Q4 earnings at $0.89 per share on revenue of $7.55 billion.

• [By ovenerio]

  Those markets are attractive because these are not commodity products. The company faces strong competition because there are thousands of designs and many suppliers, but Texas Instruments (TXN) is still a more diversified rival.

Hot Semiconductor Stocks To Invest In 2014: Analog Devices Inc (ADI)

Analog Devices, Inc. (Analog Devices), incorporated on January 18, 1965, is engaged in the design, manufacture and marketing of a range of analog, mixed-signal and digital signal processing integrated circuits (ICs). The Company produces a range of products, including data converters, amplifiers and linear products, radio frequency (RF) ICs, power management products, sensors based on micro-electro mechanical systems (MEMS) technology and other sensors, and processing products, including DSP and other processors, which are designed to meet the needs of a base of customers. The Company's products are embedded inside many different types of electronic equipment, including industrial process control systems; instrumentation and measurement systems; wireless infrastructure equipment, and aerospace and defense electronics. The Company designs , manufactures and markets a range of ICs, which incorporate analog, mixed-signal and digital signal processing technologies. The Company's product portfolio includes both general-purpose products used by a range of customers and applications, as well as application-specific products. On March 30, 2012, the Company acquired Multigig, Inc.

Analog Products

The Company's product portfolio includes several thousand analog ICs. The Company's analog IC customers include original equipment manufacturers (OEMs) and customers who build electronic subsystems for integration into larger systems. The Company is a supplier of data converter products. Data converters translate real-world analog signals into digital data and also translate digital data into analog signals. The Company is also a supplier of amplifiers. Amplifiers are used to condition analog signals. The Company provides precision, instrumentation, intermediate frequency/radio frequency (RF), broadband, and other amplifiers. The Company also offers a range of precision voltage references, which are used in a range of applications. The Company's analog product line also includes a range port! folio of RF ICs covering the RF signal chain, from RF function blocks, such as phase locked loops, frequency synthesizers, mixers, modulators, demodulators, and power detectors, to broadband and short-range single chip transceiver solutions.

The Company's RF ICs support the requirements of cellular infrastructure and a range of applications in the Company's target markets. Also within the Company's analog technology portfolio are products, which are based on MEMS technology. This technology enables the Company to build small sensors, which incorporate an electromechanical structure and the supporting analog circuitry for conditioning signals obtained from the sensing element. The Company's MEMS product portfolio includes accelerometers used to sense acceleration, gyroscopes used to sense rotation, inertial measurement units used to sense multiple degrees of freedom combining multiple sensing types along multiple axis, and MEMS microphones used to sense audio. The Company's current revenue from MEMS products is derived from the automotive end market. In addition to the Company's MEMS products, its other analog product category includes isolators. The Company's isolators have been designed for applications, such as universal serial bus isolation in patient monitors, where it allows hospitals and physicians to adopt the advances in computer technology to supervise patient health and wirelessly transmit medical records. In smart metering applications, the Company's isolators provide electrostatic discharge performance. In satellites, where any malfunction can be catastrophic, the Company's isolators help protect the power system while enabling designers to achieve small form factors. Power management & reference products make up the balance of the Company's analog sales. Those products, which include functions such as power conversion, driver monitoring, sequencing and energy management, are developed to complement analog signal chain components across core market segments from micro power, en! ergy-sens! itive battery applications to power systems in infrastructure and industrial applications.

Digital Signal Processing Products

Digital Signal Processing products (DSPs) complete the Company's product portfolio. DSPs are optimized for numeric calculations, which are essential for instantaneous, or real-time, processing of digital data generated, from analog to digital signal conversion. The Company's DSPs are designed to be fully programmable and to execute specialized software programs, or algorithms, associated with processing digitized real-time, real-world data. Programmable DSPs are designed to provide the flexibility to modify the device's function using software. The Company's DSP IC customers write their own algorithms using software development tools provided by the Company and third-party suppliers. The Company's DSPs are designed in families of products, which share common architectures and therefore can execute the same software across a range of products. The Company's customers use the Company's products to solve a range of signal processing challenges across its core market and segment focus areas within the industrial, automotive, consumer and communications end markets. As an integrated part of the Company's customers' signal chain, there are other Analog Devices products connected to its processors, including converters, audio and video codecs and power management solutions.

The Company competes with Broadcom Corporation, Maxim Integrated Products, Inc., Cirrus Logic, Inc., Microchip Technology, Inc., Freescale Semiconductor, Inc., NXP Semiconductors, Infineon Technologies, ST Microelectronics, Intersil Corporation, Silicon Laboratories, Inc., Knowles Electronics, Texas Instruments, Inc. and Linear Technology Corporation.

Advisors' Opinion:

• [By Myra P. Saefong]

  Analog Devices Inc. (ADI) reported fourth-quarter adjusted earnings of 62 cents per share on revenue of $678 million. Analysts were looking for earnings of 58 cents per share on revenue of $689 million. The company saw its stock fall 3.7% in after-hours trading after closing the regular session at $49.92, up 0.5%.

• [By Ben Eisen and Saumya Vaishampayan]

  Analog Devices Inc. (ADI) �sank nearly 3%. The semiconductor firm reported late Tuesday fourth-quarter adjusted earnings of 62 cents a share and sales of $678 million, with sales missing analyst expectations.

Hot Semiconductor Stocks To Invest In 2014: NextStage Inc (NXT)

NextStage, Inc. is a holding company. The Company is engaged in the management of its investments in shares of stocks of its subsidiaries. The Company�� subsidiaries include Mondex Philippines Inc. (MXP), Infinit-e Asia Inc. (Infinit-e Asia) and Technology Support Services, Inc. (TSSI). MXP operates a multi-application smart card system in Philippines. Infinit-e Asia is a software development company specializing on smart card and e-commerce solutions tailored to enhance the business of its clients. Infinit-e Asia develops smart card solutions for both real and online applications and on both contact and contactless platform. Infinit-e Asia�� spectrum of products and applications are classified as payments, data capture and security. TSSI is engaged in the business of business process outsourcing (BPO), applications service providers (ASP) and managed service providers (MSP). Advisors' Opinion:

• [By Namitha Jagadeesh]

  HSBC Holdings Plc (HSBA), Europe�� largest bank, slid 2.1 percent. International Consolidated Airlines Group SA (IAG) declined 2 percent as it canceled some of its flights following a disruption caused by one of its planes at Heathrow airport. Next Plc (NXT) retreated 2.4 percent as Morgan Stanley cut its recommendation on the shares.